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By combining individually controlled AXM modules to create a single, larger heat pump, operators can right-size heating and cooling performance to meet a wide range of applications.
The study suggests the advantages of improved thermal management, reduced vibration, and equalized temperature across the JBOD, which leads directly to lower failure rates and costs for data center operators.
Virginia is the largest data center market in the world, and Northern Virginia is home to more than 20% of all known hyperscale data centers worldwide.
Rapidly escalating chip power levels require data centers to adopt liquid cooling approaches to remain energy efficient and support required performance levels.
Without adequate airflow, a phenomenon known as “hot spots” is more likely to develop on the surface and in the interior of VFDs, wreaking havoc on sensitive electronics.
Available in sizes up to 100 mm, the EH Plastic Free-Swinging Hinge series provides a high-strength, economical solution for multiple interior and exterior application zones.
ECMs combine the benefits of DC electric motors with integrated drives and are primarily used to control the speed of fans, such as those found in data center fan walls and air-handling units.
ARPA-E's Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems (COOLERCHIPS) funding program aims to develop highly efficient and reliable cooling systems that will enable a new class of efficient power-dense computational systems, data centers, and modular systems.