Sumitomo Electric Industries Ltd. and US Conec Ltd. announced the execution of a definitive license agreement enabling Sumitomo Electric Lightwave Corp. to manufacture MMC connector and TMT ferrule components for the deployment of next-generation, high-density, multi-fiber cabling solutions. US Conecʼs MMC connector combines a novel, reduced footprint multi-fiber ferrule with a very small form factor (VSFF) connector footprint, which is one-third the size of the MPO format. This collaboration to deliver MMC solutions supports active hyperscale data center cabling programs and ensures a robust supply chain for emerging and future optical link architectures. Initial deployments include 24F single-mode, low-loss MMC connectors.
 
Next-generation link architectures employing 400G and beyond demand higher-density fiber-optic cabling solutions that cannot be met with existing MPO technology. The VSFF MMC connector format solves these density challenges and facilitates data center design and deployment with low-loss optical performance, use of MT-ferrule alignment structure for backward compatibility, simplified polarity and gender management, and the support of future fiber-optic cabling technologies.  

“US Conec is a leader in the development of next-generation VSFF multi-fiber connectivity, and we are pleased to partner with them to deliver connectivity solutions using their MMC connector, which is indispensable for building next-generation data centers,” said Yoshiyuki Suetsugu, deputy general manager of the Info-communications Business Unit at Sumitomo Electric. “We will leverage our precision molding technology to produce and sell solutions utilizing MMC connectivity to help customers overcome their challenges for saving space and reducing installation time, thereby contributing to the realization of an advanced information society.”