JetCool collaborates with Eaton to develop innovative liquid cooling technologies
The companies offer solutions for high-power data center applications
LITTLETON, Mass. — JetCool Technologies Inc. announced a collaboration with Eaton. The companies will develop innovative solutions for high-power applications within data centers, making it simpler for customers to adopt a complete liquid cooling solution that enhances efficiency, minimizes energy costs, and prepares facilities for rising chip thermal design power (TDP).
Rapidly escalating chip power levels require data centers to adopt liquid cooling approaches to remain energy efficient and support required performance levels. Liquid cooling provides a more efficient way to remove heat from high-power chips and, as such, is becoming increasingly popular in data centers.