BARCELONA — Schneider Electric is teaming up with Avnet and Iceotope to develop innovative, chassis-level immersive liquid cooling solutions for data centers. This partnership brings together three global technology innovation leaders: Avnet for technology integration services, Iceotope for chassis-level immersion cooling technologies, and Schneider Electric for data center infrastructure solutions.
“Compute-intensive applications like AI and IoT are driving the need for better chip performance,” said Kevin Brown, CTO and senior vice president of innovation and secure power, Schneider Electric. “Our quantitative analysis and testing of liquid cooling approaches shows significant benefits to the market. This partnership is the next step in solution development, and we are excited to be working with Avnet and Iceotope.”
Schneider Electric has invested in Iceotope through the investment arm of the Innovation at the Edge program, which includes investments, incubations, partnerships, and joint ventures with external partners to make bold ideas a reality in the transition to decentralized, digitized, and decarbonized energy.
Schneider Electric’s preliminary analysis of a chassis-level, immersion-cooled solution versus a traditional air-cooled solution shows capital expenditure (CapEx) savings of 15% and energy savings of at least 10%, which leads to a 20-year total cost of ownership (TCO) savings of over 11%.
“Largely driven by the recent explosion of IoT, the processing power needed for workloads like AI in data centers requires advanced solutions to keep connected systems operating efficiently,” said Scott MacDonald, global president, Avnet Integrated. “The development of a liquid cooling technology solution offers customers the performance needed to deliver on these growing compute demands. This is a prime example of how we work with customers to provide the advanced solutions necessary to meet the needs of data-centric workloads in virtually every industry.”
“Iceotope is delighted to work with Schneider and Avnet on a solution that delivers on the promise of liquid cooling,” said David Craig, CEO of Iceotope. “Working with great partners that share the same passion for innovative, solution-focused thinking and quality is a pleasure. Our ability to bring our IP to combined solutions that manage the pressing challenges of chip density, energy and water consumption, space and location challenges, and the ever-more complex issues relating to harsh environment and climate will be game changing in the industry.”
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