Thermal Management from Molex
The QSFP-DD BiPass Thermal Cooling Configuration is designed to provide next- generation solutions.
Molex has released its new BiPass thermal management configuration cooling QSFP-DD modules up to 20W with a 15°C change from the ambient temperature. First shown at DesignCon 2019, the Molex QSFP-DD thermal solution can cool a range of 15W to 20W in different configurations. The BiPass solution allows higher wattage modules to be cooled and will help designers on the path toward 112 Gbps.
The BiPass solution, allows designers to bypass the lossy printed circuit board by utilizing Temp-Flex high-speed twinax. Because of this, they can achieve lower insertion loss when going from an ASIC in a switch or a router to another server within a rack. Advances in heat sink technologies are enabling highly efficient, reliable and resilient thermal management strategies to support higher density in both copper and optical connectivity. From a future perspective, this great signal integrity performance and low insertion loss capability allows designers to use passive copper throughout the entire design.