As data center configurations and applications require more computing power, managers are looking at new ways to address thermal management challenges. Cooling high- and ultra-high-density setups require equipment and systems that deliver far more capacity. For instance, if the configuration requires 18 kilowatts (kW) of power consumption and cooling capacity, it is technically unfeasible using conventional approaches because it requires supplying 2,500 cubic feet per minute (cfm) of cooling per enclosure. Since traditional solutions may not be enough, engineers now have new approaches to consider, including focused cooling, scalability, flexibility, and efficiency.