STULZ USA Announces Commercial Partnership With CoolIT Systems
High density chip-to-atmosphere data center solutions to be the partnership focus.
STULZ has engaged in a strategic investment and commercial partnership with CoolIT Systems, Inc. (CoolIT), a global manufacturer of energy efficient Direct Contact Liquid Cooling (DCLC™) technologies for high performance computing, cloud, and enterprise markets.
The commercial partnership will enable the two companies to cooperate closely in delivering unique Chip-to-Atmosphere solutions across the globe. Both parties remain independently owned and operated.
“STULZ has identified Chip-to-Atmosphere cooling solutions as a growing market segment for data center environments,” said Joerg Desler, president of STULZ USA. “This alliance with CoolIT allows us to offer customers more complete solutions that involve capturing the heat at source inside the servers and moving it out to the atmosphere with STULZ technology.”
CoolIT’s DCLC technology uses the exceptional thermal conductivity of liquid to provide concentrated cooling to the hottest components inside a server, enabling very high density configurations. CoolIT’s centralized pumping liquid cooling solutions can be tailored to any server layout and have already been adopted by many server manufacturers as a reliable technology that is covered under standard warranties.
“Partnering with such an influential solution provider as STULZ provides a tremendous worldwide capacity to our company,” said Geoff Lyon, CEO & CTO at CoolIT Systems. “This strategic relationship increases our ability to better serve the data center industry with forward thinking designs, solutions and services.”
“CoolIT Systems is attractive to the global STULZ Group because they align well with STULZ’ history of bringing innovation and highly efficient technology to the data center market,” said Brian Hatmaker, vice president, STULZ USA. “We see a growing need in the market for more flexible solutions to support high performance and high density compute applications. Chip-to-Atmosphere solutions will generate immediate CAPEX and OPEX savings with minimal footprint requirements.”
The Chip-to-Atmosphere concept will be discussed in detail at ISC High Performance 2016 in Frankfurt during CoolIT Systems Exhibitor Forum Presentation: 4.40pm on Tuesday 21 June at Booth 500, Hall 3, Messe Frankfurt. Technical experts will also be available during ISC16 to answer any questions at CoolIT Systems booth, #1210.
Those interested in incorporating CoolIT Systems and STULZ solutions in their projects should start by contacting their local STULZ or CoolIT Systems sales representative.