Emerson Network Power has provided details on an innovative data center research space that will be built in Ohio to advance research and product development of data center thermal management technologies and controls.

The 38,500-sq-ft Emerson Innovation Center, also known as “The Helix,” is slated to open on the University of Dayton campus in Ohio in late 2015. The research and development space will expand the ability of Emerson Network Power’s Thermal Management business to deliver more holistic, next generation approaches to controlling the data center environment and managing heat in the most effective ways possible. Emerson Network Power engineers will collaborate with university researchers and students to use the space to develop and better understand intelligent and versatile cooling technologies and controls that improve energy efficiency, maximize free cooling and protect mission critical applications.

“The complex, dynamic nature of today’s data center requires more than just new cooling technologies,” said John Schneider, vice president and general manager, thermal management, Emerson Network Power. “The research facility will foster an ambitious, collaborative approach to conducting research and developing innovative thermal management technologies and intelligent controls that address the challenges facing data center managers.”

The data center research space will contain a variety of thermal management technology, including the breakthrough new Liebert® DSE cooling system with pumped refrigerant economization technology and the Liebert iCOM intelligent control technology. Emerson engineers initially will use the facility to advance technology development in a number of areas, including advanced controls, energy efficiency gains using free cooling and next generation component technology.

When completed, the $35 million Emerson Innovation Center will employ 30-50 people and focus on five HVACR industry markets, each with its own research module: supermarket refrigeration, food service operations, residential connected homes, data center cooling and light commercial buildings. The innovation center’s five research modules will facilitate collaboration between Emerson and the University of Dayton’s highly regarded School of Engineering.