LSI Joins The Open Compute Project
The company is contributing multiple reference designs to the OCP global community.
LSI Corporation has announced its membership in the Open Compute Project (OCP) and the contribution of two storage infrastructure reference designs to the OCP global community.
Greg Huff, LSI chief technology officer will be a featured speaker at the OCP Summit taking place, January 28-29, in San Jose, CA. Huff’s presentation titled, “The Datacentered Future,” will focus on the future vision for the datacenter and the valuable role of the OCP and vendor contributions. LSI will also showcase Open Compute technology demonstrations at its booth.
“Open Compute is about the ability to scale computing infrastructure in the most efficient and economical way possible to achieve more work per dollar,” said Huff. “LSI storage solutions play an important role in the datacenter and our technology can be found in every current contribution to the Open Compute Project. We’re excited to formally join the OCP and look forward to continued contributions to the community.”
LSI is contributing two storage infrastructure reference designs to the OCP. The first is a board design for a 12Gb/s SAS Open Vault storage enclosure. The Open Vault is a cost-effective storage solution with a modular I/O topology that’s built for the Open Rack. The storage solution is designed to enable Open Vault to optimize the performance 12Gb/s SAS infrastructure by utilizing LSI’s unique DataBolt™ bandwidth optimizer technology. DataBolt technology aggregates the performance of storage devices to enable 30-60 percent higher bandwidth from existing SATA drives in the Open Vault enclosure.
LSI is also contributing a design from its Nytro™ XP6200 series of a PCIe® flash accelerator cards, which are purpose-built to meet the requirements of Open Compute and other hyperscale servers. The Nytro XP6209 card is a 1TB flash card designed to provide hyperscale cloud datacenters with accelerated performance for read-intensive applications, optimized power and thermals, and an overall lower cost per gigabyte PCIe flash solution for server-based applications.
Huff’s keynote is scheduled for Tuesday, January 28, at 11:25 a.m. LSI technology demonstrations will be offered in LSI booth #B16.