Emerson Network Power Receives Patent for High Density Data Center Cooling Technology
Emerson Network Power has received a U.S. patent for its flexible, energy-saving Liebert® XDcooling technology for high heat density data center applications.
The pumped refrigerant-based cooling technology featured in the Liebert XD family of high heat density cooling solutions was the first rack- and row-based cooling solution to address high density at the rack level. The Liebert XD family includes the Liebert XDV rack-mount, Liebert XDO ceiling-mount, Liebert XDH row-based, and Liebert XDR rear door cooling modules.Originally designed to address hot spots or zones within the data center, the Liebert XD cooling modules provide cooling directly at the source of the heat without overcooling the whole data center.