Future Facilities Announces Virtual Facility Integration with Intel Thermal Data Feeds
Future Facilities has announced the integration between its Virtual Facility (a mathematically correct, 3-D data center model) and the new thermal sensors being embedded by Intel within its servers. This new development was revealed at the Intel Developer Forum 2012 in San Francisco this week, during a presentation involving Akhil Docca, Future Facilities’ product manager, and Jay Vincent, Intel senior technical architect.
Future Facilities CEO, Hassan Moezzi said, “Of the 40% of total power consumption dedicated to cooling in a typical non-optimized data center, up to a half is wasted. Future Facilities is therefore thrilled to be developing this solution together with an industry leader like Intel. Not only will this development make data center cooling more manageable, it will also reduce both the time and effort of deploying a predictive data center infrastructure management (DCIM) solution.”