Future Facilities North America (Future Facilities NA) has announced that its product manager, Akhil Docca, will discuss the integration between new server embedded thermal sensors and Future Facilities' Virtual Facility model at the Intel Developer Forum 2012 in San Francisco. 

During the discussion, which will take place on September 12that 10:30 a.m., Mr. Docca will join Intel's Senior Technical Architect, Jay Vincent. Together, they will highlight how the Virtual Facility can support real-time thermal data feeds from sensors embedded within Intel's servers.

The embedded thermal sensors eliminate the need for external sensors (e.g., sensors mounted on the front of the server cabinet). The embedded sensors provide real-time power, airflow and CPU-utilization data to enable effective CFD analysis and IT load capacity planning and optimization. The sensors and CFD model also facilitate the design and operation of automated cooling control systems. Of the 40% of total power consumption dedicated to cooling in a typical non-optimized data center, 30 to 50 percent is wasted.

"Future Facilities is thrilled to develop this solution with an industry leader like Intel to make data center cooling more manageable," said Sherman Ikemoto, General Manager, Future Facilities NA. "The use of this new technology greatly reduces the cost and effort of a predictive data center infrastructure management (DCIM) solution. Additionally, this new methodology will virtually eliminate the need for deploying external sensors throughout the data center."

Historically, one of the greatest data center cooling challenges has been accommodating IT power densities and airflow requirements that were not accounted for in the original cooling design. The combination of CFD modeling with data gathered from internal sensors provides data center managers a crystal ball to predict the onset of problems caused by the IT roadmap before they are implemented.