Future Facilities Incorporated’s 6SigmaET thermal simulation software is designed to solve the problem of how to shrink electronics devices that generate heat. The software is capable of analyzing different issues and features including non-rectangular shapes without the need for additional MCAD software for data entry. 6SigmaET builds on its predecessors 6SigmaDC and 6SigmaFM and is designed to apply cooling simulation technology to the business and engineering problems of moving and removing heat from electronic devices.