Copper Interconnect Products from Siemons
Siemon’s passive copper QSFP+ (Quad Small Form-factor Pluggable Plus) high-speed interconnect products have been tested and accepted by the InfiniBand Trade Association (IBTA) as compliant to the InfiniBand Architecture Specification. The assemblies were developed for high-density applications, offering a cost-effective, low-power option for high-speed data center interconnects up to 10 meters depending on wire gage and IO interface usage. Ideal for server blade-to-box, rack-to-rack and shelf-to-shelf interconnects as well as high-speed networking and storage equipment applications, the QSFP+ form factor can replace up to four standard SFP+ connections, providing greater density and reduced system cost. Interoperable with compliant SFF-8436 interfaces, Siemon’s QSFP+ copper interconnects are also fully compatible with a wide array of data protocols/interfaces, including Ethernet 10G, 40G (IEEE-802.3ba) and SONET. They also support Fibre Channel 10G, 40G SAN; FCoE, RapidIO, and Myrinet 40G systems links.